碘—氨浸出体系用于废旧印刷线路板中金的浸取

doi:10.11872/j.issn.1005-2518.2019.05.784

Abstract

Abstract:

As early as 1980s，gold leaching with iodine has been intensely researched，but it has not been applied in industry due to the high cost.In recent years，with the appearing of the drawbacks of other hydrometallurgies such as aqua regia and cyanidation，the iodine leaching system has begun to attract people’s attention again.And many researchers use iodine leaching system to leach gold from the waste printed circuit board，but the high cost is still the main factor restricting its development.In order to reduce the cost and improve the leaching rate，cheaper ammonia was used as an auxiliary complex agent in the gold leaching from waste printed circuit board by iodine system.The orthogonal experiments of influential factors，such as the solid-liquid ratio，the molar ratio of I₂/I^-，I^- concentration，ammonia concentration，eaction time were conducted.The single-factor experiments were conducted to obtain the optimum value of each factor when the gold leaching rate was the highest.The results show that at the optimal combination of various factors，the highest gold leaching rate can reach 98.6%.The solid-liquid ratio is the most significant influential factor on gold leaching，followed by the dosage of ammonia，the concentration of KI，and the molar ratio of I₂/I^-.The results of single-factor experiments show that the decrease of the solid-liquid ratio can improve the leaching rate.When pH value is between 8 and 9，molar ratio of I₂/I^- is 1∶8，KI concentration is 0.25 g/mL，the amount of ammonia is 1% (volume fraction)，the temperature is 30 ℃，and the leaching time is 4 h，the efficiency of the hybrid system of gold leaching is best，and the highest leaching rate can reach 96%.The addition of ammonia has obvious promoting effect on leaching rate.Ammonia can be used as both complexing agent and auxiliary additive in gold leaching reaction，which can participate in the complexing reaction of gold and promote the transformation of I₂ to I^-.This has certain guiding significance for reducing the leaching cost and improving the leaching rate of the gold leaching system by iodine.

Key words: metallurgical technology, printed circuit boards(PCBs), iodine, ammonia, auxiliary complex agent, gold leaching rate, orthogonal experiment

CLC Number:

Changjin LIANG, Chuanjing MA. Iodine-ammonia Leaching System for Leaching Gold from Waste Printed Circuit Boards[J].Gold Science and Technology, 2019, 27(5): 784-790.

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元素	质量浓度	元素	质量浓度
Cu	229.5	Au	0.0523
Zn	4.056	Fe	157.1
Ag	94.31	Pb	7.385

编号	固液比	I₂/I^-摩尔比	KI质量浓度/（g·mL^-1）	氨水用量（体积浓度）/%	金浸出率/%
1	1∶10	1∶4	0.05	1	62.71
2	1∶10	1∶8	0.10	2	74.86
3	1∶10	1∶12	0.15	3	70.42
4	1∶10	1∶16	0.20	4	66.86
5	1∶20	1∶4	0.10	3	80.44
6	1∶20	1∶8	0.05	4	73.33
7	1∶20	1∶12	0.20	1	86.95
8	1∶20	1∶16	0.15	2	78.43
9	1∶30	1∶4	0.15	4	80.67
10	1∶30	1∶8	0.20	3	86.23
11	1∶30	1∶12	0.05	2	89.13
12	1∶30	1∶16	0.10	1	94.67
13	1∶40	1∶4	0.20	2	96.39
14	1∶40	1∶8	0.15	1	98.5
15	1∶40	1∶12	0.10	4	90.67
16	1∶40	1∶16	0.05	3	87.33
K1	68.713	80.053	78.125	85.708	-
K2	79.788	83.230	85.160	84.703	-
K3	87.675	84.293	82.005	81.105	-
K4	93.223	81.823	84.108	77.883	-
极差R	24.510	4.240	7.035	7.825	-

Iodine-ammonia Leaching System for Leaching Gold from Waste Printed Circuit Boards

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